[Global Research Trends] 7. Leading Companies and Countries with Top Publications on Semiconductor Packaging (2000-2024)

/ Scinapse Trends Series #7

‘Scinapse Trends’ will be updated bi-weekly on Fridays with research trends to facilitate the researcher's journey .

In semiconductor research and manufacturing, Semiconductor Packaging is an indispensable material that protects the extremely fine and sensitive semiconductor chip from external factors and allows for easy electrical connections by facilitating connection to the circuit board. This technology is crucial because it greatly impacts the performance of the semiconductor itself, playing a vital role in electronic devices such as computers, smartphones, and other electronics, which have the highest production and consumption rates worldwide.

Therefore, understanding semiconductor packaging research trends is crucial for technological innovation and performance optimization, and it is essential for survival in the highly competitive semiconductor industry. Global semiconductor companies like Taiwan Semiconductor Manufacturing Company (TSMC), Samsung Electronics, and Intel invest heavily in developing semiconductor technology and devote significant resources to researching new technologies. As a result, identifying the latest trends in this field allows companies to gain a competitive advantage in the market.

The latest packaging technologies improve the size, performance, and energy efficiency of semiconductor chips, while also enhancing cost savings and production efficiency. Furthermore, miniaturization and energy efficiency are critical factors for advanced devices, playing a key role in these sectors. By understanding the trends in packaging, one can develop next-generation technologies, as semiconductor chip performance, size, power consumption, and heat management are determined by the packaging method. As such, semiconductor packaging is a crucial part of developing new semiconductor technologies and understanding the latest trends aids in advancing these technologies.

In this Scinapse Trends series, we will explore the publication trend over the past 24 years, from 2000 to 2024, to see which countries and especially each company have conducted the most research in this field.

Publication Trends on Semiconductor Packaging and Top Publication Countries & Companies (2000-2024)

The United States ranked first with an overwhelming total of 1,282 publications. When looking at company publications, Intel, Texas Instruments, and Motorola secured the 2nd, 3rd, and 4th places, respectively, taking the top spots. Meanwhile, Taiwan ranked 3rd as a country with 512 publications, but when looking at individual companies, Advanced Semiconductor Engineering claimed the top spot with 200 publications, which is about three times the volume of second-place Intel.

Below that, Japan's Hitachi, South Korea's Samsung, the U.S.'s Fairchild Semiconductor, Taiwan's Siliconware Precision Industries, and IBM (U.S.) followed, with small differences in volume, rounding out the top 10. Additionally, Intel, Motorola, and Taiwan Semiconductor Manufacturing Company (TSMC) not only have high publication numbers but also high citation counts, indicating strong qualitative as well as quantitative performance. Furthermore, while Amkor Technology ranked 12th in publications among companies, it achieved a high total of 517 citations, demonstrating significant qualitative success.

Looking at the two graphs and the data as a whole, the top five countries, excluding China, show that most have a high proportion of corporate papers, with a balance of around 50% between company and non-company publications.

Note: 2024 data is only partially reflected, and "Top Affiliation" is based on the lead author's last (the most recent) affiliation.

How Has Semiconductor Packaging Evolved Over the Past Years?

So what kind of actual research content has changed and developed over the last 3, 5, and 7 years? Over the past few years,

In the past 7 years, the research of semiconductor packaging has focused on analyzing the reliability and failure mechanisms of solder joints in electronic devices under various stress conditions and temperature cycles to enhance their performance and longevity. For the 5 years, research has focused on enhancing the reliability of solder joints in electronics through various methods such as machine learning, thermal shock testing, aging effects, and fatigue life modeling.

Finally, for the past 3 years, research has concentrated on enhancing the reliability and thermal performance of solder joints in various electronic applications through advanced testing methods and material studies.

The “AI Research Insights✨” shows how research has been conducted and progressed within your search criteria over the last 3, 5, or 7 years.

How Can I Extract Research Insights From Scinapse?

Scinapse's Research Intelligence Advanced Filter allows users to add and edit various filters according to their research objectives. This enables searching for the right paper and gaining insights into advanced research trends.

You can view the most concentrated results by starting with the Summary tab, where a summary of the desired results is displayed. In the Top Countries tab, you can see publications and average first-year citations by country, and in Top Affiliations, you can also view the h-index of each affiliation.

(However, Scinapse does not offer a feature to differentiate between the nature of institutions.)

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/ Data source - Scinapse 
Topic advised by RI Team from [PT08] Semiconductor Packaging Research Trends

/ Written by Geehee Nahm
- Content Strategist specializing in AI and SaaS industries

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